3D IC Integration and Packaging

3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.

3D IC Integration and Packaging covers:

• 3D integration for semiconductor IC packaging

• Through-silicon vias modeling and testing

• Stress sensors for thin-wafer handling and strength measurement

• Package substrate technologies

• Microbump fabrication, assembly, and reliability

• 3D Si integration

• 2.5D/3D IC integration

• 3D IC integration with passive interposer

• Thermal management of 2.5D/3D IC integration

• Embedded 3D hybrid integration

• 3D LED and IC integration

• 3D MEMS and IC integration

• 3D CMOS image sensors and IC integration

• PoP, chip-to-chip interconnects, and embedded fan-out WLP