Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Amplifier Transistor Semiconductor Devices with Dense 24 pcs Fins 5.9"x 2.3" x 0.98"1pc/ 150 mm (L) x 59mm (W) x 25mm (H)
Product Description
Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Amplifier Transistor Semiconductor Devices with Dense 24 pcs Fins 5.9"x 2.3" x 0.98"1pc/ 150 mm (L) x 59mm (W) x 25mm (H)
- Made of Aluminum, good thermal conductivity
- Reduce the risk of hardware failure due to overheating
- Maximize area Designed in with the cooling air. The 24 pcs fins increase the area of the board and thus provide for greater heat transfer
- Specially designed for high power household LED light or fish LED devices, etc
- Please make sure that the size of the heat sink fits that of your component
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
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Specifications:
100% Brand New High Quality
Material: Aluminum
Fins: 24
Size: 5.9"(L) x 2.32"(W) x 0.98"(H)/ 150mm (L)x 59mm(W) x 25mm(H)
Quantity: 1
Weight: 157g (approx.)
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Package:
1x Aluminum Heat Sink Cooling Fin
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Note:
1. Please check the specification table and make sure that the size of the heatsink fits that of your component. Thank You!
2. Please allow 1-3mm error due to manual measurement. Thanks for your understanding.
3. Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.
Technical Specifications
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