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Area Array Packaging Processes: for BGA, Flip Chip, and CSP

R 3,984

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Area Array Packaging Processes: for BGA, Flip Chip, and CSP

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
Country USA
Brand MCGRAW-HILL PROFESSIONAL
Manufacturer McGraw-Hill Professional
Binding Hardcover
UPCs 639785505525
EANs 0000071428291
ReleaseDate 0000-00-00

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