BSFF
Thermal Paste with Toolkit CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance 4g
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R 568
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Delivered in 10–20 working days —
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30-day return window
Description
- SAFETY APPLICATION: BSFF is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to the CPU and VGA card.
- BETTER THAN LIQUID METAL: It is made of carbon microparticles, guaranteeing extremely high thermal conductivity. This ensures that heat from the CPU/GPU is dissipated quickly & efficiently.
- HIGH DURABILITY: BSFF thermal paste Edition formula has excellent component heat dissipation performance and has the stability to push the system to the limit.
- EXCELLENT PERFORMANCE: In contrast to metal and silicon thermal conductive adhesives, BSFF thermal paste will not compromise over time. After applying, you do not need to apply again because it will last at least 6 years.
- EASY TO APPLY: BSFF thermal paste has ideal consistency and is very easy to use even for beginners
Technical Specifications
Manufacturer
Nuomi Chemical(Shenzhen) Co., Ltd.
Model
BS-155
Size
4g
Weight
0 kg
Shipping & Delivery
Your order is shipped from the USA and delivered to your door in South Africa in 10–20 working days. All items are fully tracked.
Returns & Exchanges
We offer a 30-day return window. If something isn't right, contact our support team and we'll make it right.