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Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

R 6,580

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Due to be released on : 2026-04-15
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Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
Country USA
Brand Springer
Manufacturer Springer
Binding Hardcover
ReleaseDate 2026-04-15
UnitCount 1
EANs 9789819568901

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Country	USA
Brand	Springer
Manufacturer	Springer
Binding	Hardcover
ReleaseDate	2026-04-15
UnitCount	1
EANs	9789819568901