Product features: This product is used when the pins of IC and other components are shorted with solder
It can clean away the solder adhered to the pins and the pad.
Make sure there is no short circuit between pins. In addition, when planting balls for BGA components, tin absorption wire is used to clean the pad of BGA components, so that the success rate of planting balls is greatly increased.
The use of pure copper and special chemicals refined, to ensure the use of easy, fast, save.
Used for removing excess solder, good oxidation corrosion resistance, good thermal conductivity, tin absorption effect is very good,