Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® (The Springer International Series in Engineering and Computer Science, 719)

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® (The Springer International Series in Engineering and Computer Science, 719)

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Product Description

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® (The Springer International Series in Engineering and Computer Science, 719)

Technical Specifications

Country
USA
Brand
Springer
Manufacturer
Springer
Binding
Paperback
PartNumber
black & white illustrations
Model
black & white illustrations
IsAdultProduct
Height
9.21
Length
6.14
Weight
0.65918216338
Width
0.44
ReleaseDate
2012-10-14T00:00:01Z
NumberOfItems
1