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Halnziye 10Gram Thermal Conductive Glue Silicone Plaster Viscous Adhesive Cooling Compound for LED GPU Chipset Heatsink

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Halnziye 10Gram Thermal Conductive Glue Silicone Plaster Viscous Adhesive Cooling Compound for LED GPU Chipset Heatsink
- Do Not Use Thermal Glue Between CPU Chip And Heat Sink, use it within 24 hours once opened.
- Thermal conductivity:> 1.2W/m-K
- Strength of connected buildings: 55 lb.
- Features: thermal properties, strong adhesion
- Application: apply to all heatsink no fixed clip thermal paste. Ideal for MOSFET Heatsinkï VGA CARD Northbridge Southbridge Heatsink.
* Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink, VGA CARD Northbridge Southbridge Heatsink.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (200°C/392°F / 24Hours)
* Evaporation: 0.001% (200°C/392°F / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: <0.06
* Clotting time: 3min (25°C/77°F
* Strength of connected buildings: 25Kg/55Lb
* Insulation coefficient> 5.1
* Dissipation coefficient <0.005
* Temperature resistance: 200°C/392°F
* Net Weight: 10g

Do Not Use Thermal Glue Between CPU Chip And Heat Sink
Country USA
Brand Halnziye
Manufacturer Halnziye
Binding Misc.
ItemPartNumber HY910-T10
Model HY910-T10
Color clear
Size HY910 - 10g
ReleaseDate 0000-00-00

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