Hengtianmei

60/40 Rosin Core Low Temp Tin Lead Solder Wire, for Soldering Electronic Devices (1.2mm/50g)

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R 978
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Description

  • Rosin solder wire content parameters: Tin 60% lead 40% (Sn 60% Pb 40%), rosin flux content: 1.8%.
  • Electronic solder wire product parameters: Diameter 1.2mm (0.047 inch), net weight 50g (1.76 oz), melting point around 183 ℃ (361 ℉). 
  • Low melt solder wire usage effect: A reasonable alloy content ratio and the addition of rosin flux make the solder joints firm, with a full color and luster. Excellent fluidity makes it easier for you to operate.
  • Solder wire application scope: The above characteristics make it suitable for soldering various electronic components and manual DIY operations.
  • We have a professional service team, ready to provide the best service for each customer, look forward to the start of cooperation, if you have any questions, please feel free to contact us.
Technical Specifications
Manufacturer
HengTianMei
Model
1.2
Color
Silver
Shipping & Delivery

Your order is shipped from the USA and delivered to your door in South Africa in 10–20 working days. All items are fully tracked.

Returns & Exchanges

We offer a 30-day return window. If something isn't right, contact our support team and we'll make it right.