MG Chemicals SAC305, No Clean Unleaded Solder, 99.3 Percent

MG Chemicals SAC305, No Clean Unleaded Solder, 99.3 Percent Tin and 0.7 Percent Copper, 2 lb. Bar
- Unleaded, complies with RoHS
- Exceeds the impurity requirements of j-std-006
- No clean flux, excellent wettability
- Hard non-conductive residues
- NSF - Nonfood Compounds Program Listed P1, NSF Registration #144214
M.G. Chemicals no clean lead-free solder was designed with 99.3 percent Tin and 0.7 percent copper alloys as a lead-free alternative for the standard Tin and lead solder. These alloys conform to the impurity requirements of j-std-006 and RoHS. Use this solder anywhere you would use normal solder. M.G. Chemicals lead free solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our lead free solder is 2.0-4.0 percent. A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA Type. This special activator exhibits virtually no spattering. Activator conforms to j-std-004, REL0. Cleaning flux core is a no clean formulation therefore the residues do not need to be removed for Typical applications. Cu content: 0.3-0.7 percent . Sn content: balance. Flux classification: REL0. Copper mirror: no removal of copper film. Silver chromate: pass. Corrosion: pass. Sir jstd-004,pattern down: 2.33 x 10 11 OHMS. Sir bell core (telecordia): 6.12 x 10 11 OHMS. Electro migration: pass. Post reflow flux residue: 55 percent . Acid value: 190-210. Flux residue dryness: pass. Spitting of flux-cored solder: 0.30 percent . Solder spread : 130 MM2. Melting point: 227 degree C (441 degree F). upper temperature limit: do not to exceed 350 degree C (tip temperature). wire diameter: 0.032" (0.81 mm). standard wire gauge: 21. Tolerance: +/- 0.002". hardness, Brinell: 9HB. Coefficient of thermal expansion: Pure sn=23.5. Tensile strength: 3190 psi. Density: 7.31 G/cc. Electrical resistivity: 10 - 15 micro ohm-cm
Country USA
Brand MG Chemicals
Manufacturer MG Chemicals
Binding Misc.
ItemPartNumber 4901-2LB
Model 4901-2LB
UnitCount 1
UPCs 779008490198
EANs 0779008490198
ReleaseDate 0000-00-00

Country	USA
Brand	MG Chemicals
Manufacturer	MG Chemicals
Binding	Misc.
ItemPartNumber	4901-2LB
Model	4901-2LB
UnitCount	1
UPCs	779008490198
EANs	0779008490198
ReleaseDate	0000-00-00

MG Chemicals SAC305, No Clean Unleaded Solder, 99.3 Percent Tin and 0.7 Percent Copper, 2 lb. Bar

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