WIVIE
Sn99/Ag0.3/Cu0.7 Lead-Free Solder Paste, 217°C Melting Point, T4 Particle (100g)
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R 1,733
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Description
- Premium SAC0307 Alloy - Sn99/Ag0.3/Cu0.7 Composition Ensures Strong Welding Joints And Oxidation Resistance.
- Low-Temp Melting At 217°C - Prevents Pcb And Component Damage During Soldering.
- T4 Fine Particle Size (20-38μm) - Ideal For Precision Stencil Printing And Mini-Component Soldering.
- No-Clean Flux Residue - Non-Corrosive, Non-Conductive, And Requires No Post-Cleaning.
- Wide Applications - Suitable For BGA, SMT and PCB Repairs In Consumer Electronics.
Shipping & Delivery
Your order is shipped from the USA and delivered to your door in South Africa in 10–20 working days. All items are fully tracked.
Returns & Exchanges
We offer a 30-day return window. If something isn't right, contact our support team and we'll make it right.