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Sn99/Ag0.3/Cu0.7 Lead-Free Solder Paste, 217°C Melting Point, T4 Particle (100g)

R 1,709

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Sn99/Ag0.3/Cu0.7 Lead-Free Solder Paste, 217°C Melting Point, T4 Particle (100g)
- Premium SAC0307 Alloy - Sn99/Ag0.3/Cu0.7 Composition Ensures Strong Welding Joints And Oxidation Resistance.
- Low-Temp Melting At 217°C - Prevents Pcb And Component Damage During Soldering.
- T4 Fine Particle Size (20-38μm) - Ideal For Precision Stencil Printing And Mini-Component Soldering.
- No-Clean Flux Residue - Non-Corrosive, Non-Conductive, And Requires No Post-Cleaning.
- Wide Applications - Suitable For BGA, SMT and PCB Repairs In Consumer Electronics.
Country USA
Brand WIVIE
Manufacturer WIVIE
Binding Misc.
Model 100g
ReleaseDate 0000-00-00

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Country	USA
Brand	WIVIE
Manufacturer	WIVIE
Binding	Misc.
Model	100g
ReleaseDate	0000-00-00