Sopagre
Sn99/Ag0.3/Cu0.7 SMD Welding Paste217°C High Temperature Lead-free No Clean Solder Paste For Phone Component Repair
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R 1,306
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Delivered in 10–20 working days —
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Description
- Lead-Free Solder Paste Content: Alloy Tin 99% Ag 0.3 Cu0.7%, Solder Flux Content: 10.5%
- Product Parameters: Total Weight: 50g
- Paste Features: Lead-Free, No Clean, Strong Viscosity, Bright Welding Point
- Package Includes: A Bottle of Solder Paste
- Paste Features: Lead-Free Solder Paste - Low Temperature Solder Paste With Flux, Melting Point: 218°C
- Applications: Widely Used in Circuit Board, lC, BGA /SMD Circuit Board,Motors, Lighting,TV and OtherHousehold Appliances And industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors,Lighting, connectors,SMT Maintenance
Shipping & Delivery
Your order is shipped from the USA and delivered to your door in South Africa in 10–20 working days. All items are fully tracked.
Returns & Exchanges
We offer a 30-day return window. If something isn't right, contact our support team and we'll make it right.