Chip Quik SMD291AX50T3 Solder Paste in jar 50g (T3) Sn63/Pb37

Chip Quik SMD291AX50T3 Solder Paste in jar 50g (T3) Sn63/Pb37 no clean
- Chip Quik SMD291AX50T3 Solder Paste: Contains 50g of solder paste for SMD components
- Made with Sn63/Pb37 alloy: Provides reliable electrical and thermal conductivity
- No clean required: Saves time and effort in the soldering process
- Compatible with most SMD components: Suitable for use in electronic devices
- Made by Chip Quik: A trusted brand in electronics soldering and repair
Description Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90.25% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 183C (361F) Size: 50g jar Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Country USA
Brand Chip Quik
Manufacturer Chip Quik®
Binding Unknown Binding
ItemPartNumber SMD291AX50T3
Model SMD291AX50T3
Color silver
UPCs 700254127156
EANs 0700254127156
ReleaseDate 0000-00-00

Country	USA
Brand	Chip Quik
Manufacturer	Chip Quik®
Binding	Unknown Binding
ItemPartNumber	SMD291AX50T3
Model	SMD291AX50T3
Color	silver
UPCs	700254127156
EANs	0700254127156
ReleaseDate	0000-00-00

Chip Quik SMD291AX50T3 Solder Paste in jar 50g (T3) Sn63/Pb37 no clean

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