TIQQHKIN

Soldering Lugs Rework Pad for Phone IC Pad BGA PCB Repair Copper Spot Welding Point Fix Tool with Jumpwire Function Microsoldering Pad for Motherboard Jumper Wire and Fingerprint Welding

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R 661
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Delivered in 10–20 working days —
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30-day return window

Description

  • Professional Repair Solution：This high - quality rework pad is designed for mobile phone IC spot soldering and PCB pad repair. It enables professional - level repairs without expensive equipment, making it ideal for electronics repair shops and hobbyists.
  • Superior Material & Construction：Crafted from premium copper , this pad offers excellent conductivity and heat resistance. It ensures reliable connections even in challenging scenarios.
  • Time & Cost - Efficient：Simply remove the protective layer and apply it for quick, traceless repairs without circular marks, eliminating the need for flying wire techniques.
  • Enhanced Stability & Flatness：Equipped with reinforced retaining pins to stay securely in place during soldering. Its exceptional flatness prevents virtual welding issues caused by uneven surfaces.
  • Easy Application for BGA & PCB Repairs：Perfect for BGA pad restoration, PCB trace repair, and motherboard maintenance. It improves repair efficiency with seamless results, restoring circuit functionality without damaging surrounding components.
Technical Specifications
Manufacturer
TIQQHKIN
Model
RP-066
Weight
0.02 kg
Shipping & Delivery

Your order is shipped from the USA and delivered to your door in South Africa in 10–20 working days. All items are fully tracked.

Returns & Exchanges

We offer a 30-day return window. If something isn't right, contact our support team and we'll make it right.