Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)

Product ID: 1032160853 Condition: New

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Product Description

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)

Technical Specifications

Country
USA
Brand
CRC Press
Manufacturer
CRC Press
Binding
Paperback
PartNumber
Refer to Sapnet.
Height
9.21
Length
6.14
Weight
1.0361726314
Width
0.64
NumberOfItems
1