Springer
Wafer Bonding
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R 6,978
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Description
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
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Your order is shipped from the USA and delivered to your door in South Africa in 10–20 working days. All items are fully tracked.
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